AG10KSDE176

AG10K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs. The device AG10K offers supreme quality, stability, and exceptional pricing value.

Features

• High-density architecture with 10K LEs

• M9K embedded memory blocks, up to 414Kbits of RAM space

• Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers

• Provides 2 PLLs per device provide clock multiplication and phase shifting

• High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL

• Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL

• General package options, LQFP-144, -176 and FBGA-256

• Flexible device configuration through JTAG and SPI interface

• Support remote update, by "dual-boot" like implementation

• Refer "User Guide" for special AS mode configuration

The new device AG10KL144H ，provide higer performance and in-line debugging.

AG10KSDE176 device is AG10K FPGA bonded with 64MBit 32-bit 166MHz SDRAM. AG10KSDE176 is pin-to-pin compatible with AG16KSDE176.

AG10K FPGA器件针对大容量、成本敏感的应用，使系统设计人员能够在降低成本的同时满足日益增长的性能要求。设备AG10K提供了最高的质量，稳定性和卓越的定价价值。

特性

• 高密度架构，10K LEs

• M9K嵌入式内存块，高达414Kbits的RAM空间

• 多达23个18 x 18位嵌入式乘数器，每个都可配置为两个独立的9 x 9位乘数器

• 每个设备提供2个锁相环，提供时钟乘法和相移

• 高速差分I/O标准支持，包括LVDS, rsd, mini-LVDS, vpecl

• 单端I/O标准支持，包括3.3V、2.5V、1.8V、1.5V LVCMOS和LVTTL

• 通用包装选项，LQFP-144， -176和FBGA-256

• 通过JTAG和SPI接口灵活配置设备

• 支持远程更新，通过“双启动”式实现

• 特殊AS模式的配置请参考《用户指南》 • 工作结温范围为 -40 至 100 °C

-新器件AG10KL144H，提供更高的性能和在线调试。

-AG10KSDE176设备是AG10K FPGA内置64MBit 32位166MHz SDRAM。 AG10KSDE176与AG16KSDE176 pin-to-pin兼容。

AG10K_Rev1.1.pdf

MANUAL_AG10KSDE176.pdf

AG10K_guide.pdf

AG10K_E176_SDRAM_PCB.pdf

AG10KSDE176_Pinout.xls

AG10KSDE176_io_LVDS.xls