AG16KSDE176

AG16K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs. The device AG16K offers supreme quality, stability, and exceptional pricing value.

Features

• High-density architecture with 16K LEs

• Up to 504Kbits of RAM space

• Up to 56 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers

• Provides 4 PLLs per device provide clock multiplication and phase shifting

• High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL

• SSTL, SSTL-II IO standard, support DDR, DDR2

• Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL

• General package options, LQFP-176 and FBGA-256

• Two 12-bits SarADC (embedded temp sensor)

• Flexible device configuration through JTAG and SPI interface

• Support remote update, by "dual-boot" like implementation

• Support on chip signal debugging

AG16KSDE176/AG16KSDF256/AG16KSDE176G devices are AG16K FPGA bonded with 64MBit 32-bit 166MHz SDRAM :

- AG16KSDE176, QFP-176 papckage suppports 2-layer PCB(cost-down) design. AG16KSDE176 is pin-to-pin compatible with AG10KSDE176.

- AG16KSDF256,  FBGA-256 package supports 152 user IOs and 3 additional ADC IO.

- AG16KSDE176G, QFP-176 package suppports 2-layer PCB(cost-down) design, with 139 user IOs.

 - AG16KDDF256 device is AG16K FPGA bonded with 128MBits 16-bit 200MHz DDR-SDRAM, FBGA-256 package supports 170 user IOs.

AG16K FPGA器件针对大容量、成本敏感的应用，使系统设计人员能够在降低成本的同时满足日益增长的性能要求。设备AG16K提供了最高的质量，稳定性和卓越的定价价值。

• 高密度架构，16K LEs

• 高达504Kbits的RAM空间

• 多达56个18 x 18位嵌入式乘数器，每个都可配置为两个独立的9 x 9位乘数器

• 每个设备提供4个锁相环（PLL），提供时钟乘法和相移

• 高速差分I/O标准支持，包括LVDS, rsd, mini-LVDS, vpecl

• SSTL、SSTL- ii IO标准，支持DDR、DDR2

• 单端I/O标准支持，包括3.3V、2.5V、1.8V、1.5V LVCMOS和LVTTL

• 通用包装选项，LQFP-176和FBGA-256

• 2个12位SarADC(嵌入式温度传感器)

• 通过JTAG和SPI接口灵活配置设备

• 远程更新，通过“双启动”式实现

• 支持芯片信号调试

• 工作结温范围为 -40 至 100 °C

-------------------------------------------------------------------------------------

AG16KSDE176/AG16KSDF256/AG16KSDE176G器件是AG16K FPGA 内部封装了 64MBit 32位166MHz SDRAM:

- AG16KSDE176, QFP-176包装支持两层PCB(低成本)设计。AG16KSDE176与AG10KSDE176 pin-to-pin兼容。

- AG16KSDF256、FBGA-256包支持152个用户IOs和3个额外的ADC IO。

- AG16KSDE176G, QFP-176封装支持两层PCB(低成本)设计，139用户IOs。

- AG16KDDF256设备是AG16K FPGA内部封装了 128MBits 16位200MHz DDR-SDRAM, FBGA-256包支持170用户IOs。

AG16K_Rev1_0.pdf

MANUAL_AG16KSD.pdf

AG16KSDE176(G)_Pinout.xls

AG16KSDE176(G)_io_LVDS.xls

AG16K_E176_SDRAM_PCB.pdf

Manual_remote.pdf